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BE Semiconductor Industries N.V. - Comparative Business Analysis Snapshot
Business Description
BE Semiconductor Industries N.V.. The Group's principal activity is the manufacturing of semiconductor packaging, plating, die attach and die sort equipment for the semiconductor industry. The equipment is used to produce semiconductor packages, which provide the electronic interface and physical connection between the chip and other electronic components. The equipment also protects the chip from the external environment. The packaging equipment consists of automated molding systems that encapsulate semiconductor devices in epoxy resin. The plant and singulation equipment consists of fully automated tin-lead planting systems. The die attach equipment consists of manual and automated high precision systems which place the contact points of the chip in direct contact with the packaged substrate. The Group operates worldwide.
Competitor Analysis
This analysis compares BE Semiconductor Industries N.V. with three other companies in closely related industry sectors.
The full Comparative Business Report is available to Subscribers or may be purchased individually. The full report generally includes the following sections:
- Sales Analysis: Recent Sales, Sales Growth, Sales per Employee
- Recent Stock Performance
- Company Valuation Ratios: Price/Earnings, Price/Book Value
- Price/Sales and 52 Week Price change
- Dividend Analysis
- Profitability Analysis: Gross Profit Margin, EBITDA Margin
- Earnings Before Extraordinary Items
- Inventory Analysis
- Research and Development Expenses
- Financial Position: Long Term Debt/Equity, Days Accounts Receivable, Days Inventory
- R&D Expenses/Sales
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