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Fortuna Technologies Incorporation - Comparative Business Analysis Snapshot
Business Description
Fortuna Technologies Incorporation Formerly known as Fupo Electronics Corporation. The Company's principal activities are researching, developing, manufacturing and selling connection technology of metal bumps, connection technology of wafers and liquid crystal, automatic connection technology of multi-layers metal rolls and advanced chip packaging electronic components. Major products and services include gold bumping process, solder bumping process, chip on glass, TAB, bond pad rerouting process, chip on glass, bumped wafer testing, TCP assembly, final testing, LCD module assembly design, COG, and COF. The Company exports its products to Asia, Europe and the United States of America.
Competitor Analysis
This analysis compares Fortuna Technologies Incorporation with three other companies in closely related industry sectors.
The full Comparative Business Report is available to Subscribers or may be purchased individually. The full report generally includes the following sections:
- Sales Analysis: Recent Sales, Sales Growth, Sales per Employee
- Recent Stock Performance
- Company Valuation Ratios: Price/Earnings, Price/Book Value
- Price/Sales and 52 Week Price change
- Dividend Analysis
- Profitability Analysis: Gross Profit Margin, EBITDA Margin
- Earnings Before Extraordinary Items
- Inventory Analysis
- Research and Development Expenses
- Financial Position: Long Term Debt/Equity, Days Accounts Receivable, Days Inventory
- R&D Expenses/Sales
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