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Shinkawa Ltd. - Company Profile Snapshot
| Company Profile: |
Shinkawa Ltd. |
| Ticker: |
6274 |
| Exchanges: |
TYO |
| 2009 Sales: |
10,403,000,000 |
| Major Industry: |
Machinery & Equipment |
| Sub Industry: |
Industrial Machinery |
| Country: |
JAPAN |
| Employees: |
647 |
Business Description
Shinkawa Ltd.. The Group's principal activity is to research, manufacture, market and sell bonding devices such as wire bonders, die bonders, tape bonders, flip chip bonders and other semiconductor manufacturing equipment. The Group also provides related services including installment, fixing, maintenance and repair for its products. The operations are carried out through the following divisions: Wire bonders; Die bonders; Tape bonders; Flip chip bonders; Repairing parts and Other equipment.
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The following information is available to subscribers or can be accessed by purchasing the Company Profile Report:
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- Address (mailing), Phone Number, Web Address
- Earnings/Dividends
- Employees
- Exchanges Listed
- Financial Ratio Analysis |
- Recent Stock Performance
- Sales (recent year)
- Senior Officers
- Shareholder Information
- Stock Analysis Summary |
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