|
Chipbond Technology Corp - Company Profile Snapshot
| Company Profile: |
Chipbond Technology Corp |
| Ticker: |
6147 |
| Exchanges: |
TAI |
| 2008 Sales: |
5,263,700,000 |
| Major Industry: |
Electronics |
| Sub Industry: |
Miscellaneous Electronics |
| Country: |
TAIWAN |
| Employees: |
1664 |
Business Description
Chipbond Technology Corp. The Company's principal activities are researching, developing, manufacturing and selling gold bump, solder bump, wafer bumping, tape carrier packaging, flip chip, chip on film, chip on glass and wafer level. Operations are carried out in Taiwan. The Company exports its products to Asia, Europe and the United States of America.
|
Not the Report you are looking for?
Click here for more browsing options.
|
The following information is available to subscribers or can be accessed by purchasing the Company Profile Report:
|
- Address (mailing), Phone Number, Web Address
- Earnings/Dividends
- Employees
- Exchanges Listed
- Financial Ratio Analysis |
- Recent Stock Performance
- Sales (recent year)
- Senior Officers
- Shareholder Information
- Stock Analysis Summary |
Layout and Content of a Typical Report
|
|
|
|
|
