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Amkor Technology, Inc - Earning & Dividend Analysis Snapshot
This detailed Report provides an Earnings and Dividends history for Amkor Technology, Inc. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.
Amkor Technology, Inc. The Group's principal activity is the subcontracting of semiconductor packaging and test services. The Group's semiconductor products are used as components in electronic systems used in communications, Computing, consumer, industrial and automotive applications. The Group operates in two segments: Packaging services and Test services. Packaging services process creates an electrical interconnect between the semiconductor chip and the system board through wire bond or wafer bump technologies. Test services provide probing of fabricated wafers and testing of packaged chips using sophisticated equipment. The Group also offers test services for analog, digital, logic, mixed signal and radio frequency semiconductor devices. The major customers of the Group are Altera Corporation; Atmel Corporation, Conexant Systems Inc, Freescale Semiconductor Inc and Intel Corporation. It operates in the United States, China, Japan, Taiwan, Korea, Singapore and Philippines.
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