BE Semiconductor Industries N.V. - Earning & Dividend Analysis Snapshot

This detailed Report provides an Earnings and Dividends history for BE Semiconductor Industries N.V.. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.

BE Semiconductor Industries N.V.. The Group's principal activity is the manufacturing of semiconductor packaging, plating, die attach and die sort equipment for the semiconductor industry. The equipment is used to produce semiconductor packages, which provide the electronic interface and physical connection between the chip and other electronic components. The equipment also protects the chip from the external environment. The packaging equipment consists of automated molding systems that encapsulate semiconductor devices in epoxy resin. The plant and singulation equipment consists of fully automated tin-lead planting systems. The die attach equipment consists of manual and automated high precision systems which place the contact points of the chip in direct contact with the packaged substrate. The Group operates worldwide.

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