Semitool, Inc. - Earning & Dividend Analysis Snapshot

This detailed Report provides an Earnings and Dividends history for Semitool, Inc.. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.

Semitool, Inc.. The Group's principal activities are to design, manufacture, install and service highly engineered equipment for use in the fabrication of semiconductor devices. The Group's products are focused on the wet chemical process steps in integrated circuit or IC manufacturing and include systems for wafer surface preparation and electrochemical deposition or ECD applications. The primary suites of tools of the Group include electrochemical deposition systems for electroplating copper, gold, solder and other metals, cleaning, stripping and etching systems and wafer container cleaning tools. The equipment is utilized in semiconductor fabrication front-end and back-end processes, including wafer level packaging. The customers of the Group include major semiconductor device and wafer level packaging manufacturers worldwide. The Group operates in the United States, Europe, Japan, Taiwan and other Asian countries.

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