Duksan Hi-Metal Company Limited - Earning & Dividend Analysis Snapshot

This detailed Report provides an Earnings and Dividends history for Duksan Hi-Metal Company Limited. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.

Duksan Hi-Metal Company Limited. The Company's principal activity is manufacturing of solder balls used in the semiconductor packaging processes. The solder balls are used for electronic package types such as ball grid array, chip scale package and flip chip, which electrically and mechanically connect silicon dies and substrates and printed circuit boards.

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