Kingpak Technology Inc - Earning & Dividend Analysis Snapshot

This detailed Report provides an Earnings and Dividends history for Kingpak Technology Inc. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.

Kingpak Technology Inc. The Group's principal activities are manufacturing, processing, constructing, testing and selling of semi conductor products. It provides integrated circuit (IC) packaging and testing services. Its IC packaging services include ball grade array (BGA), such as tiny BGA, product in package (PIP), stacked multi-chip package (MCP), tiny PIP, land gray array (LGA), secure digital (SD), micro SD, mini SD and multimedia card (MMC), complementary metal-oxide semiconductor (CMOS) image sensors, compact camera modules (CCMs), cubic and tiny plastic leaded chip carriers (PLCCs). The Group exports its products to Asia, Europe and the United States of America.

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