Kinsus Interconnect Technology Corp - Earning & Dividend Analysis Snapshot

This detailed Report provides an Earnings and Dividends history for Kinsus Interconnect Technology Corp. Tabular results include up to a ten-year history of "as reported" Earnings per Share and Dividends per Share plus a calculation of the amount of earnings paid out over the year in dividends (i.e. Payout Ratio). Earnings and Dividends are presented on both a Quarterly and Annual basis. An annual Percent Change factor is calculated for both Earnings and Dividends.

Kinsus Interconnect Technology Corp. The Group's principal activity is manufacturing ball grid array (BGA) boards. It is also engaged in wholesale and retail trade. Products include PBGA, CSP, cavity down, SiP, flip chip, COB and COF. Operations are carried out in Taiwan and other countries. The Group exports its products to Asia, the United States of America and Europe.

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