Shinkawa Ltd. - Price Analysis Snapshot

This Report features up to a ten-year record of the equity Price history for Shinkawa Ltd.. Tabular results include the High, Low and Closing price for the quarter. There is also a calculation of percentage change in price for both Quarterly and Annual periods. Price values are adjusted for stock splits and dividends.

Shinkawa Ltd.. The Group's principal activity is to research, manufacture, market and sell bonding devices such as wire bonders, die bonders, tape bonders, flip chip bonders and other semiconductor manufacturing equipment. The Group also provides related services including installment, fixing, maintenance and repair for its products. The operations are carried out through the following divisions: Wire bonders; Die bonders; Tape bonders; Flip chip bonders; Repairing parts and Other equipment.

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