Kinsus Interconnect Technology Corp - Price Analysis Snapshot

This Report features up to a ten-year record of the equity Price history for Kinsus Interconnect Technology Corp. Tabular results include the High, Low and Closing price for the quarter. There is also a calculation of percentage change in price for both Quarterly and Annual periods. Price values are adjusted for stock splits and dividends.

Kinsus Interconnect Technology Corp. The Group's principal activity is manufacturing ball grid array (BGA) boards. It is also engaged in wholesale and retail trade. Products include PBGA, CSP, cavity down, SiP, flip chip, COB and COF. Operations are carried out in Taiwan and other countries. The Group exports its products to Asia, the United States of America and Europe.

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