Shinkawa Ltd. - Sales Analysis Snapshot

Business Description
This Report provides a comprehensive Sales & Margin summary analysis for Shinkawa Ltd. Tabular results include up to a ten-year history on Sales, EBITDA (Earnings before Interest, Taxes, Depreciation and Amortization), Income before Extraordinary Items and number of Employees. Additional ratios are included for sales growth, earnings and income as a percent of sales and Sales per Employee.

Shinkawa Ltd.. The Group's principal activity is to research, manufacture, market and sell bonding devices such as wire bonders, die bonders, tape bonders, flip chip bonders and other semiconductor manufacturing equipment. The Group also provides related services including installment, fixing, maintenance and repair for its products. The operations are carried out through the following divisions: Wire bonders; Die bonders; Tape bonders; Flip chip bonders; Repairing parts and Other equipment.

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