Kingpak Technology Inc - Sales Analysis Snapshot

Business Description
This Report provides a comprehensive Sales & Margin summary analysis for Kingpak Technology Inc Tabular results include up to a ten-year history on Sales, EBITDA (Earnings before Interest, Taxes, Depreciation and Amortization), Income before Extraordinary Items and number of Employees. Additional ratios are included for sales growth, earnings and income as a percent of sales and Sales per Employee.

Kingpak Technology Inc. The Group's principal activities are manufacturing, processing, constructing, testing and selling of semi conductor products. It provides integrated circuit (IC) packaging and testing services. Its IC packaging services include ball grade array (BGA), such as tiny BGA, product in package (PIP), stacked multi-chip package (MCP), tiny PIP, land gray array (LGA), secure digital (SD), micro SD, mini SD and multimedia card (MMC), complementary metal-oxide semiconductor (CMOS) image sensors, compact camera modules (CCMs), cubic and tiny plastic leaded chip carriers (PLCCs). The Group exports its products to Asia, Europe and the United States of America.

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